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item

data

remark

min. line width(mil)

min. space(mil)

4/5

4mil for gold finger

min. pad(mil)

pth: 4mil

the distance between the hole edge and the pad edge。

component hole：7mil

min. hole diameter

board thickness< 2.0mm

0.2mm

finish hole。

board thickness≥2.0mm

aspect ratio ≤8

finish hole。

min. hole diameter

board thickness< 2.0mm

3.2mm

board thickness≥2.0mm

6.0mm

min. board thickness

single-layer / double-layer

0.2mm

multi-layer

4 layer:0.4mm；6 layer:0.8mm；8 layer:1.0mm；10 layer:1.2mm

the distance between the line and board edge

milling:0.20mm

v-cut: 0.4mm

max. layer

solder mask

solder mask opening(mil)

2/4

1. only one side；2.the tolerance is within 2 mil in order to avoid the exposure of solder mask dam.

solder mask dam (mil)

between ic pins。

color

white, black, blue, green, yellow, red and so on

rigid-flex board

8 layers

8 layers

surface finish

osp、enig、flash gold、immersion tin、hasl、tin plating、immersion silver

legend

min. space(mil)

5/8

color

white, yellow, black and so on

surface finish

plating tin、plating ni/a, enig and so on

plating layer thickness

technology

thickness

minimal thickness

maximal thickness

gold plating

au.thickness

100

150

nithickness

enig

nithickness

100

150

au.thickness

gold finger

ni. thickness

120

150

gold thickness

hole copper（micron）

copper thickness

base copper thickness

copper thickness of inner and out layer（oz）

0.5

finish copper thickness

out layer

6.5

inner layer

0.5

pp thickness(mm)

0.06

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line width/space(mil)

max. copper thickness

4/4(gold finger);4/5;

0.5oz

the line width is not less than the required in condition of keeping the line space.

6/7

1oz

8/8

2oz

8/12

3oz

5oz

base material type

fr-4; alu. base material；high frequency material；ptfe；fpc；super-thick copper clad laminate；paperboard；bt material；pi material；rogers4003 (ppc:4403)