production
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item |
data |
remark |
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min. line width(mil) |
4 |
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min. space(mil) |
4/5 |
4mil for gold finger | ||||
min. pad(mil) |
pth: 4mil |
the distance between the hole edge and the pad edge。 | ||||
component hole:7mil |
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min. hole diameter | board thickness< 2.0mm |
0.2mm |
finish hole。 |
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board thickness≥2.0mm |
aspect ratio ≤8 |
finish hole。 |
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min. hole diameter | board thickness< 2.0mm |
3.2mm |
0
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board thickness≥2.0mm |
6.0mm |
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min. board thickness | single-layer / double-layer |
0.2mm |
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multi-layer |
4 layer:0.4mm;6 layer:0.8mm;8 layer:1.0mm;10 layer:1.2mm |
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the distance between the line and board edge |
milling:0.20mm |
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v-cut: 0.4mm |
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max. layer | 36 | |||||
solder mask | solder mask opening(mil) |
2/4 |
1. only one side;2.the tolerance is within 2 mil in order to avoid the exposure of solder mask dam. |
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solder mask dam (mil) |
6 |
between ic pins。 |
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color |
white, black, blue, green, yellow, red and so on |
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rigid-flex board | 8 layers | 8 layers | ||||
surface finish | osp、enig、flash gold、immersion tin、hasl、tin plating、immersion silver | |||||
legend | min. space(mil) |
5/8 |
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color |
white, yellow, black and so on |
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surface finish |
plating tin、plating ni/a, enig and so on |
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plating layer thickness |
technology |
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gold plating |
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enig |
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gold finger |
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hole copper(micron) |
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base copper thickness |
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finish copper thickness |
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pp thickness(mm) |
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line width/space(mil) |
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4/4(gold finger);4/5; |
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the line width is not less than the required in condition of keeping the line space.
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6/7 |
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8/8 |
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8/12 |
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base material type | fr-4; alu. base material;high frequency material;ptfe;fpc;super-thick copper clad laminate;paperboard;bt material;pi material;rogers4003 (ppc:4403) |